1.  Applications
It is developed for the foundry industry, It works particularly well when bonding EPS & STMMA foam.

2.  Technical data sheet

HC-G-H01：

HC-G-H03：

3.  Suggested application temperature
HC-G-H01：175°C -- 185°C depending upon substrates to be bonded. Never exceed 200°C 
HC-G-H03：130°C  -- 140°C depending upon substrates to be bonded.

4.  Packaging
12 kg. carton.

5.  Storage
Store in a cool and dry place preferably at 5°C – 25°C.

6.  Fire-fighting measures
product does not burn. Use extinguishing measures appropriate to the surroudings of the fire.
Extinguishing media: dry powder, CO2, sand, water.